Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
The TTVs are 27mm X 27mm BGA packages with 1mm pitch, 0.6mm diameter balls in a partially populated 26X26 array (480 balls). Twelve strategically placed ball sets are available for daisy-chain applications.
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