Phone: 650-961-5900
FAX: 650-323-9237
E-Mail: info@thermengr.com
FAX: 650-323-9237
E-Mail: info@thermengr.com
|
Phone: 650-961-5900
FAX: 650-323-9237 E-Mail: info@thermengr.com |
*** STANDARDS STATUS - EIA/JEDEC***
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EIA JEDEC Standards (Developed by JC15.1 Committee)
| JESD51 | Methodogy for the Thermal Measurement of Component Packages (Single Semiconductor Device) |
| JESD51-1 | Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device) |
| JESD51-2 | Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) |
| JESD51-3 | Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages |
| JESD51-4 | Thermal Test Chip Guidelines (Wire Bond-type Chip) |
| JESD51-5 | Extention of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms |
| JESD51-6 | Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air) |
| JESD51-7 | High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages |
| JESD51-8 | Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board |
| JESD51-9 | Test Boards for Area Array Surface Mount Package Thermal Measurements |
| JESD51-10 | Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements |
| JESD51-11 | Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements |
To view linked documents (requires Adobe Acrobat Reader), click on desired standard document number and log in at the JEDEC web site..
Further information can be found at http://www.jedec.org
Printed version of documents available from:
Gobal Engineering Documents
1-800-854-7179 (USA & Canada)
303-397-7956
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