TEA Logo

*** STANDARDS STATUS - US Military ***
TEA presents this information for the benefit of its Web-site visitors and does not warrant, endorse or otherwise take responsibility for any information presented below or actions derived from said information.

Please click on the Method you want to view or download.

Mil Std 750
Method 3101
Thermal transient testing for die attachment evaluation of Diodes
Mil Std 750
Method 3103
Thermal impedance measurements of Insulated Gate Bipolar Transistors
Mil Std 750
Method 3104
Thermal impedance measurements of GaAs MESFETs
Mil Std 750
Method 3131
Thermal resistance measurements of Bipolar Junction Transistors
(emitter to base forward voltage, emitter-only switching method)
Mil Std 750
Method 3161
Thermal impedance measurements for vertical power MOSFETs
(delta source-drain voltage method)
Mil Std 883
Method 1012
Thermal characteristics of Integrated Circuits
(See JEDEC JESD51 for more up to date standard)

To obtain printed and bound copies of these documents, please contact:

Defense Printing Service Office
700 Robbins Ave/Bldg 4D
Philidelphia, PA 19111-5094
USA
Phone: 1-215-697-2179












Want to add information to the above list? Click here for Message Form

Return to TEA main page