|
Phone: 650-961-5900
FAX: 650-323-9237 E-Mail: info@thermengr.com |
*** STANDARDS STATUS - SEMI ***
TEA presents this information
for the benefit of its Web-site visitors and does not warrant, endorse
or otherwise take responsibility for any information presented below or
actions derived from said information.
SEMI Standards (Developed by
US and Japanese Committees/Task Forces)
| G30-88 | SEMI Test Method: Junction-to-Case Thermal Resistance Measurments of Ceramic Packages |
| G32-87 | SEMI Guidline: Unencapsulated Thermal Test Chip |
| G38-87 | SEMI Test Method: Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages (Replaced by G38-96) |
| G42-96 | SEMI Specification: Thermal Test Board Standardization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages |
| G43-87 | SEMI Test Method: Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages |
| G46-88 | SEMI Test Method: Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits |
| G38-96 | SEMI Test Method: Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages |
| G42-96 | SEMI Specification: Thermal Test Board Standization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages |
| G68-96 | SEMI Test Method: Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Package |
To obtain copies of these documents, please click on the linked standard
number, visit the SEMI
web site or contact:
| SEMI - USA
801 East Middlefied Rd. Mountain View, CA 94043 USA Tel: 415-964-5111 FAX: 415-967-5375 |
SEMI - Japan
7F Kenwa Building 4-7-15 Kudan-miniami Chiyoda-ku Tokyo 102 Japan Tel: 03-3222-5755 FAX: 03-3222-5757 |
SEMI - Europe
CCL House 59 Fleet Street London EC4Y UU England Tel: FAX: 44-01-583-9171 |
Want to add information to the above list? Click here for Message Form
Return to TEAmain page