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*** STANDARDS STATUS - SEMI ***
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SEMI Standards (Developed by US and Japanese Committees/Task Forces)
 

G30-88 SEMI Test Method: Junction-to-Case Thermal Resistance Measurments of Ceramic Packages
G32-87 SEMI Guidline:  Unencapsulated Thermal Test Chip
G38-87 SEMI Test Method: Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages     (Replaced by G38-96)
G42-96 SEMI Specification: Thermal Test Board Standardization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages
G43-87 SEMI Test Method:  Junction-to-Case Thermal Resistance Measurements of Molded-Plastic Packages
G46-88 SEMI Test Method: Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits
G38-96 SEMI Test Method:  Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
G42-96 SEMI Specification: Thermal Test Board Standization for Measuring Junction-to- Ambient Thermal Resistance of Semiconductor Packages
G68-96 SEMI Test Method: Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Package

To obtain copies of these documents, please click on the linked standard number, visit the SEMI web site or contact:
 

SEMI - USA
801 East Middlefied Rd.
Mountain View, CA 94043
USA
Tel: 415-964-5111
FAX: 415-967-5375
SEMI - Japan
7F Kenwa Building
4-7-15 Kudan-miniami
Chiyoda-ku
Tokyo 102
Japan
Tel: 03-3222-5755
FAX: 03-3222-5757
SEMI - Europe
CCL House
59 Fleet Street
London EC4Y UU
England
Tel:
FAX: 44-01-583-9171

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