Phone: 650-961-5900 FAX: 650-323-9237 E-Mail: bsiegal@thermengr.com

Products:
• Thermal Test Systems - TEA offers a line of test systems for thermal measurements of semiconductor devices (including thermal test die) for use in product design validation, device characterization and package comparisons. These systems operate over the Heating Time range of 1ms to 5,000 seconds for use in thermal transient, natural and forced convection thermal characterization and production test applications.
• Thermal Test Fixtures - Dual Cold Plate fixture system for detailed modeling validation. Fixtures also available for thermal transient, junction-tocase thermal resistance (copper block, fan-cooled copper block or liquid), junction-to-ambient thermal resistance, etc.
• Thermal Test Environments - Forced (Moving Air) and Natural (Still Air) Convection environments in conformance with JEDEC JESD51-6 & JESD51-2, respectively. Custom versions also available.
• Thermal Test Boards - JEDEC JESD51-series compliant standard boards for component thermal measurement and characterization. (See Consulting Services for information on custom-designed standard-compliant boards.)
• Thermal Resistance Artifacts - Fully calibrated and tested devices in common packages that can be used as a reference for your thermal measurements. Artifacts provide thermal tranient and several thermal reistance values.
• Thermal Test Die - Contact TEA for potential sources of thermal test die.
• Thermally-related Software - TEA will soon be offering a collection of software specifically related to the thermal measurement, modeling and management field.

If you would like more information on any of these Products or have suggestions for other products that TEA should consider, please contact us by e-mail using the address shown above. You can also use the TEA message response form.
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