Phone: 650-961-5900
FAX: 650-323-9237
FAX: 650-323-9237
E-Mail: bsiegal@thermengr.com
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Phone: 650-961-5900
FAX: 650-323-9237 E-Mail: bsiegal@thermengr.com
|
| TEA offers
a series of thermal test boards for package characterization and design
comparison that conform to to the JEDEC JESD51 standards. The board family,
referred to as the TTB-1000 series, consists of two different standard
sizes designed to cover a wide range of package sizes. These boards, also
referred to as test coupons, provide a well defined mounting environment,
will withstand temperatures to 125 oC, and have lead lands terminated
in eyelets to allow for hand-wired connection
to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector. The TTB-1000 series consist of two different standard sizes
(depending on package size) and two different thermal conductivities (low
and high Keff). Boards are also available for special packages,
For a complete data sheet in ".pdf" format, please click here. |
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