Contract Testing - This service addresses the thermal transient screening of medium and large devices lots for die attachment integrity. The information derived from this service is also useful for statistical control of the die/chip attachment process in production applications.
Referee Measurements - This service is offered to resolve differences in thermal test results between two or more parties (customer & supplier, between suppliers, etc.). TEA can review testing procedures of the parties and/or make fully-documented independent measurements on the same devices used for comparison by the parties involved.
If you would like to discuss any of these Testing Services, please contact us by e-mail using the address shown on the main page. You can also use the TEA message response form.
Click here to return to PRODUCTS/SERVICES CATALOG main page or use your browser's back arrow button to return to the prior page.